Table of contents
Thermal management of multi‐chip module and printed circuit board using FEM and genetic algorithms
K. Jeevan, G.A. Quadir, K.N. Seetharamu, I.A. AzidTo determine the optimal chip/component placement for multi‐chip module (MCM) and printed circuit board (PCB) under thermal constraint.
Flexible electronics: silicon meets paper and beyond
J. WhitmarshTo consider the various aspects of this emerging market and to query the traditional view of thick film deposition and processing for successful flexible electronic production.
Performance exploration of adder architectures for small to moderate‐sized low‐power, high‐performance adders
Anu Gupta, Chandra ShekharThe objective is to explore various adder architectures using different logic‐design styles and transistor‐sizes for different operand sizes. The scope of this work is the…
Delay analysis of a single voltage‐scaled‐repeater driven long interconnect
Rajeevan Chandel, S. Sarkar, R.P. AgarwalTo study the effect of voltage‐scaling on output voltage waveform, delay and power dissipation in a single inverter/repeater driven interconnect load, in different technology…
Effects of MOSFET mismatch on the performance of single supply low voltage operational amplifiers
Radhalakshmi Ramakrishnan, Maqsood A. ChaudhryIn this paper, we study the effect on the performance of a single supply low voltage operational amplifier due to such a mismatch.
Transition time considerations in repeater‐chains
Rajeevan Chandel, S. Sarkar, R.P. AgarwalIn this short communication, transition times of input signals for various stages of a repeater‐chain loaded VLSI interconnects are studied.
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson