Microelectronics International: Volume 29 Issue 1

Properties of magnesium oxide and magnesium oxide‐bismuth oxide mixed thick film

The purpose of this paper is to study properties of magnesium oxide and mixed magnesium oxide‐bismuth oxide thick films for application in tuned devices.

Current‐mode highpass, bandpass and lowpass filters using followers

The purpose of this paper is to present two new follower‐based current‐mode multifunction filters. Each of the proposed circuits can realize highpass, bandpass and lowpass…

Reliability evaluation and modeling of high density electronic packages

The purpose of this paper is to describe key failure mechanisms observed during the development of the advanced packaging technology. Extensive accelerated stress tests are…

Design of a class‐E transcutaneous energy transmitter for an implantable system

The purpose of this paper is to develop a model of the inductive link for implantable systems. The model is suitable for a cochlear implant in which a lateral misalignment and…

Study of I‐V characteristics of ZnO film on Si substrate with Ag buffer layer by C‐AFM

The purpose of this paper is to demonstrate the I‐V characteristics of ZnO film on Si substrates with Ag buffer layer by conductive atomic force (C‐AFM).

Polysilicon nanogap fabrication using a thermal oxidation process

Nanogap electrodes have important applications in power saving devices, electrochemical sensors and dielectric detections of biomolecules. The purpose of this paper is to report…

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints

The purpose of this paper is to discuss the reliability of board level Sn‐Ag‐Cu (SAC) solder joints in terms of both thermal cycling and drop impact loading conditions, and…

MEMS ICs entering mass consumer markets

MEMS-in-mobile market to reach $1.5bn in 2016 – ABI Research

High performance strategy for Sensichips

Atotech’s new semiconductor grade chemistry facility in Neuruppin, Germany

Fujitsu Standardizes on Cadence DFM Technologies for 28 nm ASIC and mixed-signal designs

Cadence and GLOBALFOUNDRIES significantly speed design for manufacturing signoff at 32, 28 nanometers

SmartKem’s novel organic semiconductor materials achieve “better than amorphous-silicon” performance

Melexis integrated MEMs sensors handle more than just pressure

International diary

CSR drives SiRFstarIV technology into the automotive market to deliver automotive-qualified location and connectivity triumvirate

OC White appoints Etek Europe as exclusive UK distributor for range of inspection lamps and microscopes

Scottish chip-maker clinches deal with China as production milestone reached

Multitest MT9928xm deployed for calibration of MEMS oscillators

NanoKTN’s support facilitates research collaboration between the University of Southampton and Oxford instruments

Synopsys and Achronix announce multi-year renewal of synthesis partnership

Fairchild Semiconductor wins Electronic Product Design’s 2011 e-Legacy Award

Intel and Micron receive Most Innovative Flash Memory Technology Award at 2011 Flash Memory Summit

Renesas Electronics announces the RL78/F12 microcontrollers, the first integrated products for automotive applications in the new RL78 family

Silver clad copper wire replaces solid-silver, trims costs

A day at the European Microelectronics Packaging Conference Brighton, Sussex 12-15 September 2011

Atotech’s semiconductor R&D team developed advanced electrochemical deposition copper chemistries capable of plating state-of-the-art Damascene structures with feature sizes down to 20 nm