Table of contents
Quality Assurance in the Production of High‐quality Solder Powder—the Essential Prerequisite for Microelectronic Grade Solder Pastes
R. RuthardtThe tremendous growth in the SMT market has led to a corresponding increase in demand for electronic‐grade solder pastes for the various reflow solder processes. The high quality…
Anodised Aluminium as an Alternative Substrate for High Power Hybrid Microelectronics
S. BrakspearAn investigation to evaluate the suitability of anodised aluminium as a substrate material has shown that the relatively high coefficient of thermal expansion of the aluminium…
Flexible High Performance TAB Inner Lead Bonding with a Laser
P.J. Spletter, C. MacKay, Y. Jee, C.T. Galanakis, N. Luijtjes, O.C. WoodardMCC has been developing the use of flashlamp pulsed Nd:YAG laser technology to bond TAB leadframes to bumped IC die. With basic equipment, the process has been proven in a…
Thermal Analysis in CAD of Hybrid Circuits
G. De MeyIn this contribution a short review is given on thermal analysis of hybrid circuits using 2‐D, 3‐D and time‐dependent models. It will be shown which models are necessary to be…
Interface Reactions during Metal/Ceramic Diffusion Bonding
C.D. Qin, B. DerbyThe strength of annealed ZrO2/Pd diffusion bonds was found to be weakened after annealing in both air and vacuum. Annealing in air reduces the strength much faster and more…
Research into Optoelectronic Components
O. Hildebrand, J. Benoit, A. DudaOptoelectronic components such as lasers and avalanche photodiodes have already revolutionised long distance transmission, and yet the technology is still in its infancy. Future…
Realisation of Hydrotalcite‐type Protonic Conductor Thick Films by the Screen‐printing Technique
J.E. Moneyron, A. de Roy, J.P. BesseA new type of realisation of the hydrotalcite‐type lamellar compound Zn2AI(OH)6Cl.nH2O is described, using an original ink composed of a concentrated aqueous suspension of…
Thermal Resistance and Temperature Cycling Endurance of DCB Substrates
W. Martin, B. Waibel, W. LaaserAutomotive ignition modules are constructed employing power transistors which are soldered to metallised ceramic substrates to achieve electrical insulation and good heat…
The Use of Thermal Imaging to Assess Electronic Components
N. Gionis, D.S. CampbellAn investigation involving the use of thermal imaging has been undertaken, both on trimmed thick film resistors and on wave soldered joints to surface mounted devices. The surface…
Ibiden Company Ltd, Ogaki, Japan
H.T. LayThe visit to the Ibiden Company in Ogaki gave me the opportunity to see at first hand a part of the industry which has participated in the technological and economic miracle of…
Book review
The problem of providing a reliable and cost‐effective interconnection system between semiconductor devices and other add‐on components and the film circuit has been central to…
ISHM news
H. Binner, H.T. Law, N. Sinnadurai, G. Jones, P.E. OngleyFollowing the discussion at our recent Annual General Meeting, a questionnaire was sent out to all members. Almost half of them replied despite the fact that the time allowed for…
Industry news
National Starch and Chemical Corporation have announced the appointment of Graham Jones as sales manager, Electronic Materials and Adhesives (EM&A), Europe, headquartered at…
New products
A screen printable, thick film dielectric materials system, for printing capacitors with Z5U thermal characteristics, has been introduced by Heraeus. IP9300 high K capacitor…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson