Design for assembly

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Assembly Automation

ISSN: 0144-5154

Online from: 1980

Subject Area: Mechanical & Materials Engineering

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Document Information:
Title:	Design for assembly
Author(s):	Zulki Khan, (Nexlogic Technologies, Inc., San Jose, California, USA)
Citation:	Zulki Khan, (2008) "Design for assembly", Assembly Automation, Vol. 28 Iss: 3, pp.200 - 206
Keywords:	Design for assembly, Electronic equipment and components, Medical products
Article type:	General review
DOI:	10.1108/01445150810889961 (Permanent URL)
Publisher:	Emerald Group Publishing Limited
Abstract:	Purpose – The purpose of this paper is to explain the growing importance of design for assembly (DFA) and design for test (DFT) for compact medical electronics products. Design/methodology/approach – The paper discusses compact products based on leading-edge electronic components such as digital signal processors, radio frequency (RF) and mixed-signal chips, advanced ball-grid array, quad flat pack, chip scale package devices. Findings – Advanced technologies like these create higher component and joint counts and increasing PCB densities. A higher probability of defects and faults is created, which lead to lower yields for a specific product line unless proper effective DFA and DFT are implemented. Practical implications – The paper details DFA, high-speed PCB design, mixed-signal design, and DFT. Originality/value – With increasing complexity in compact medical products, it is prudent to emphasize DFA and DFT for ultimate reliability during product development and production cycles.