Research on the Correlation Effect of Innovation Activities on Innovators and Customers ˜ Using the IC Package and Testing Industries as an Example

Shiaw-Wen Tien; Yi-Chan Chung; Chih-Hung Tsai; Chung-Yun Dong

doi:10.1108/15982688200700027

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Asian Journal on Quality

ISSN: 1598-2688

Online from: 2000

Subject Area: Managing Quality

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Research on the Correlation Effect of Innovation Activities on Innovators and Customers ˜ Using the IC Package and Testing Industries as an Example

Document Information:
Title:	Research on the Correlation Effect of Innovation Activities on Innovators and Customers ˜ Using the IC Package and Testing Industries as an Example
Author(s):	Shiaw-Wen Tien, (Graduate Institute of Management of Technology, Chung-Hua University 30 Tung-Shiang, Hsin-Chu, Taiwan, ROC), Yi-Chan Chung, (Department of Industrial Engineering and Management, Ta-Hwa Institute of Technology, 1 Ta-Hwa Road, Chung-Lin, Hsin-Chu, Taiwan, ROC), Chih-Hung Tsai, (Department of Industrial Engineering and Management Ta-Hwa Institute of Technology, 1 Ta-Hwa Road, Chung-Lin, Hsin-Chu, Taiwan, ROC), Chung-Yun Dong, (Graduate Institute of Management of Technology, Chung-Hua University 30 Tung-Shiang, Hsin-Chu, Taiwan, ROC)
Citation:	Shiaw-Wen Tien, Yi-Chan Chung, Chih-Hung Tsai, Chung-Yun Dong, (2007) "Research on the Correlation Effect of Innovation Activities on Innovators and Customers ˜ Using the IC Package and Testing Industries as an Example", Asian Journal on Quality, Vol. 8 Iss: 3, pp.81 - 112
Keywords:	Innovator, Wafer level chip size packing, Wire bonding
Article type:	General review
DOI:	10.1108/15982688200700027 (Permanent URL)
Publisher:	Emerald Group Publishing Limited
Abstract:	In the competitive global market, firms have to keep profit from innovation activities. A firm makes profits by offering products or services at a lower cost than its competitors or by offering differentiated products at premium prices that more than compensate for the extra cost of differentiation. The IC Package and Testing technology industries were the first high technological industry to build in Taiwan. The Package and Testing industries in Taiwan adopted competitive innovation activities to become stronger. In our study, we want to know how innovation activities influence a firm operating in the IC Package and Testing industries. Our study used a questionnaire and Likert five-point scale to survey the innovation activities, customer and feedback in innovation performance in the IC Package and Testing industry. The wafer level chip size packing technology in our study indicates the innovation activities. Because we need to compare the difference between the wafer level chip size packing technology and wire bonding technology to recognize innovation and how the innovator and customer were influenced. Our conclusions are described below: (1) When the innovator adopts innovation activities that can be maintained using experiments and knowledge, using machine and decision variables more quickly will produce success; (2) Innovators should adopt innovation activities that focus on customers that use knowledge and experimentation, training time and cost. If an innovation forces customers to spend much time and cost to learn new technology or applications, the innovation will not be adopted; (3) Innovators that create innovation performance higher than his customers must also consider the impact upon their customers. We have to remind innovator to focus on why their customers have a different level of evolution in the same innovation activities.