Microelectronics International
Issue(s) available: 130 – From Volume: 1 Issue: 1, to Volume: 41 Issue: 3
Volume 40
Volume 38
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process
Muhammad Hakeem Mohammad Nazri, Tan Chou Yong, Farazila B. Yusof, Gregory Soon How Thien, Chan Kah Yoong, Yap Boon KarDie edge quality with its corresponding die strength are two important factors for excellent dicing quality especially for low-k wafers due to their weak mechanical properties and…
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer
Gözde Konuk Ege, Özge Akay, Hüseyin YüceThis study aims to investigate the ammonia-sensing performance of polyaniline/polyethylene oxide (PANI/PEO) and polyaniline/polyethylene oxide/zinc oxide (PANI/PEO-ZnO) composite…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson