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Journal cover: Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

Subject Area: Electrical & Electronic Engineering

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Table of contents:
Volume 25 issue 3 - Latest Issue

Published: 2013, Start page: p139

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Articles
Article Id: Article Information:
17090249 Growth behaviors of tin whisker in RE-doped Sn-Zn-Ga solder
Huan Ye, Songbai Xue, Cheng Chen, Yang Li (pp. 139 - 144)
Keywords: Alloys, Growth behavior, Growth mechanism, Solder alloys, Solders, Tin whisker
Article type: Research paper
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17090250 Filling analyses of solder paste in the stencil printing process and its application to process design
Won-Sang Seo, Jong-Bong Kim (pp. 145 - 154)
Keywords: Electronic engineering, Micro bumps, Solder paste, Squeegee angle, Squeegee speed, Stencil printing
Article type: Research paper
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17090251 An alternative JEDEC test board design and analysis
Fang Liu, Guang Meng, Junfeng Zhao (pp. 155 - 163)
Keywords: Drop impact, Failure, IMC, Lead-free solder joint
Article type: Research paper
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17090252 The behaviour of solder pastes in stencil printing with electropolishing process
Yong-Won Lee, Keun-Soo Kim, Katsuaki Suganuma (pp. 164 - 174)
Keywords: 01005 chip components, Alloys, Electropolishing, Laser-cut stencil, Lead-free solders, Surface-mount technology, System-in-package, Tin
Article type: Research paper
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17090253 Comparison study of SAC405 and SAC405+0.1%Al lead free solders
Roman Kolenák, Robert Augustin, Maroš Martinkovic, Michal Chachula (pp. 175 - 183)
Keywords: Lead-free solder, Shear strength, Soldering, Spreadability, Wettability
Article type: Research paper
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New products

Article Id: Article Information:
17090268 New and improved technical specification for the Nordson DAGE XD7800 Ruby XL X-ray inspection system
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17090269 Henkel debuts high-reliability Pb-free solder alloy for high-temperature applications
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17090270 Seika Machinery picks up processing speeds with the Sayaka SAM-CT23W
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International diary

17090273 International diary
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Industry news

17090257 Novel IeMRC funded Solder Flux Project Starts
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17090258 SMART Group joins United Kingdom Electronics Alliance
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17090259 Inovar, Inc. chooses Juki again
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17090260 The right solution for a growing contract manufacturer
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17090261 Computrol installs Assembléon AX-501 pick-and-place system at Utah plant
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17090262 IPC Crowns Winner of Hand Soldering World Championship
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17090263 Hover-Davis announces appointment of AdoptSMT as its distributor in Austria and Switzerland
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17090264 Europlacer converts old machines to provide new solutions
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17090265 JUKI and Sony sign memorandum of intent regarding integration of SMT equipment and related businesses
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17090266 Etek Europe invests in Parmi HS70 Solder Paste Inspection System for UK Technology Centre
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17090267 MIRTEC Europe expands into new facility that better meets customer needs
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Conferences and exhibitions

17090271 Essential updates on RoHS and REACH; an Electronics Yorkshire (EY) Seminar
Martin Goosey
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17090272 Smart Group “Back to Basics” Hands-on Rework and Inspection Workshop
Pete Starkey
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Appointments

17090254 Invotec Group appoints Monique Berckvens as European Sales Support and Account Manager
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17090255 Essemtec hires experienced specialist as demo and training manager
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17090256 ASC International hires Michael Riddle as AOI Product Manager
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