The resin-flowing model in prepreg lamination of print circuit board

This paper aims to show a resin-flowing model based on Darcy’s law to display the flowing properties of prepreg during lamination. The conformity between the model and experimental results demonstrates that it can provide a guideline on print circuit board (PCB) lamination.

Based on the theoretical derivations of Darcy’s law, this paper made an analysis on the flow of prepreg in the pressing process, according to which a theoretical model, namely, resin-flowing model was further formulated.

This paper establishes a resin-flowing model, according to which two experiment-verified conclusions can be drawn: first, the resin-flowing properties of material A and B can be improved when the heating rate is between 1.5 and 2.5 min/°C; second, increased pressure gradient can add the amount of flowing resin, mainly featured by increasing pressure and reducing filled thickness of prepreg.

This model provides guidance on setting lamination parameters for most kinds of prepregs and decreasing starvation risk for PCB production.