Liquid photoimageable soldermask application methods and their influence on processing

Abstract

Describes the application methods currently available for liquid photoimageable (LPI) soldermasks and discusses how these different methods influence the soldermask's processing and its capability at the three main processing stages of coating, drying and imaging. The paper concludes with a description of the use of an evaluation matrix based on LPI application key success factors (KSF) derived from current and future demands.

Citation

Tibbals, S. (2003), "Liquid photoimageable soldermask application methods and their influence on processing", Circuit World, Vol. 29 No. 2, pp. 27-32. https://doi.org/10.1108/03056120310454970