The sonochemical surface modification of materials for electronic manufacturing. The effect of ultrasonic source to sample distance

Abstract

Purpose

To build on the results detailed in the previous paper where it was shown that sonochemical surface modification could be achieved in water. This paper aims to look at one of the factors affecting sonochemical surface modification, namely the ultrasonic source to sample distance.

Design/methodology/approach

Ultrasound was applied through deionized water for the surface modification of three materials: a high Tg PCB laminate (Isola 370HR), a polyphenylene ether – polystyrene polymer (Noryl HM4025) and an acrylonitrile‐butadiene‐styrene/polycarbonate (Cycolac S705). The efficacy of the treatment was determined by weight loss, scanning electron microscopy, contact angle, roughness and tape testing after electroless copper plating.

Findings

The study confirmed, and extended the previous findings, that a range of substrates could be sonochemically surface modified in water, even though in this work the ultrasonic horn had a larger tip size and produced a different ultrasonic intensity. Although the results were material dependent, the ultrasonic source to sample distance was found to be critical. Employing a spacing of 5 mm produced samples which generally exhibited higher weight loss, roughness and significant changes in surface morphology than when a distance of 25 mm was utilized.

Originality/value

The paper demonstrates that sonochemical surface modification has the potential to be a much more sustainable surface modification process than those currently employed in the electronics industry. However, to achieve this outcome acoustic cavitation and factors affecting it (such as source to sample distance) must be understood so that suitable equipment can be built.

Citation

Cobley, A. and Mason, T. (2008), "The sonochemical surface modification of materials for electronic manufacturing. The effect of ultrasonic source to sample distance", Circuit World, Vol. 34 No. 3, pp. 18-22. https://doi.org/10.1108/03056120810896236