The application of X‐rays in the failure analysis of electronic devices and systems

Abstract

Purpose

The aim is to focus on the application of X‐rays in the failure analysis of electronic devices and systems, with an emphasis on X‐ray radiography and X‐ray spectroscopy.

Design/methodology/approach

The theory behind X‐ray radiography and X‐ray spectroscopy is reviewed, and relevant case studies are used to illustrate the application of these techniques in the failure analysis of electronic devices and systems.

Findings

Examples from recent case studies are given.

Originality/value

The paper provides an introduction to X‐ray methods for engineers working on the failure analysis of electronic devices and systems who may be unfamiliar with these techniques.

Citation

Smith, C.A. (2008), "The application of X‐rays in the failure analysis of electronic devices and systems", Circuit World, Vol. 34 No. 3, pp. 31-39. https://doi.org/10.1108/03056120810896254