Citation
Skwarek, A. (2015), "IMAPS-CPMT 2014 Poland – Circuit World", Circuit World, Vol. 41 No. 3. https://doi.org/10.1108/CW-06-2015-0025
Publisher
:Emerald Group Publishing Limited
IMAPS-CPMT 2014 Poland – Circuit World
Article Type: Guest editorial From: Circuit World, Volume 41, Issue 3
The International Microelectronics and Packaging Society (IMAPS) – Poland Chapter was established in September 1982. In the beginning, it was the ISHM – Poland Chapter and, from 1997, it became the IMAPS – Poland Chapter.
The IMAPS is a non-profit-making organization whose aim is to spread knowledge related to hybrid microelectronics – a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS-CPMT organization.
The 38th IMAPS-CPMT Poland International Conference was held in Rzeszów-Czarna at the Perła Bieszczadów Hotel and took place between the 21 and 24 September 2014. This event was organized by Rzeszów University of Technology. The scope of the conference covered everything in electronics between the chip and the system. The conference was attended by 85 participants, including 19 guests from abroad, and 14 invited lectures and 71 posters were presented. The conference was supported by one domestic and five international journals indexed by Thomson Reuters.
In this special issue of Circuit World, seven papers have been collected, covering the processes and procedures associated with interconnections and PCBs and their design and manufacture.
The first paper, by Drabczyk et al., describes the fabrication of screen-printed copper front electrodes for solar cell applications.
The results of investigations reported in the second and third papers (by Wróblewski et al.) prove the usability of carbon nanotubes for application in printed electronics.
The next paper reports on the good sensitivity and linearity of obtained graphene electrodes, which are key for measurement of low-concentration species (Pepłowski et al.).
The fifth paper, by Winiarski et al., discusses the electrical properties of thin-film Ni-P resistors over a wide range of temperatures.
In the last two papers, Stęplewski et al. describe different aspects of embedded component technology.
I would like to thank all the authors for their scientific work and contributions that have led to the development and publication of this special issue of Circuit World. I hope that it will be of interest to readers of the journal and that it will help them find novel solutions, contribute to the creation of new ideas and initiate many varied discussions about PCBs and related interconnection technologies. I believe that this branch of science will continue to effectively develop in the future.
Agata Skwarek - Guest Editor