IMAPS 2015 Poland

Citation

Skwarek, A. (2016), "IMAPS 2015 Poland", Circuit World, Vol. 42 No. 1. https://doi.org/10.1108/CW-10-2015-0057

IMAPS 2015 Poland

Article Type: Guest editorial From: Circuit World, Volume 42, Issue 1

The International Microelectronics and Packaging Society (IMAPS) Poland Chapter was established in September 1982. In the beginning, it was the International Society for Hybrid Microelectronics (ISHM)-Poland Chapter, and from 1997, it became the IMAPS-Poland Chapter. The IMAPS is a non-profit-making organization, whose aim is to spread knowledge relating to hybrid microelectronics – a key technology in the assembly and application of semiconductors, thin film circuits and printed circuit boards (PCBs) to form practical miniaturized electronic equipment. In 2008, the IMAPS joined with the Institute of Electrical and Electronics Engineers (IEEE) Components, Packaging and Manufacturing Technology (CPMT) Society, bringing into formation the IMAPS-CPMT organization.

The 39th IMAPS Poland International Conference was held in Gdańsk, at the hotel Dwór Prawdzica, and took place between 20 and 23 September 2015. This event was organized by the Gdańsk University of Technology. The scope of the conference covered “everything in electronics between the chip and the system”. The conference was attended by 99 participants, including 21 guests from abroad. During the conference, 18 invited lectures and 78 posters were presented, and it was supported by five international journals indexed in the Journal Citation Report database.

This year, for the first time, two young scientists have been acknowledged at the conference, both winning a refund of the fee for next year’s IMAPS 2016 Poland Conference.

In this special issue of Circuit World, seven papers have been selected from the conference, covering the processes and procedures associated with PCB design and manufacture. In the first paper, Janeczek et al. investigate screen-printed high frequency (HF) antennas for radio-frequency identification (RFID) on-metal transponders in which a magnetic sheet is used as a substrate material. The influence of magnetic sheets and polymer pastes on the geometry and electrical properties of screen-printed HF antennas has been demonstrated. The purpose of the second paper (by Pietrikova et al.) was to find an optimal surface treatment for commonly used polymeric substrates to achieve high adhesion of printed structures. The results have proved the correlation between wettability, surface energy and work of adhesion with respect to the theoretical background. Wójcik et al., in the third paper, present the physical limitations of embedding standard packaging components into PCBs, which could be a more reasonable technology for popular industrial products and small series production runs. The next paper reports the application of direct bonded copper substrates for prototyping of power electronic modules (Grzesiak et al.) The fifth paper by Baszyński et al. then discusses the importance of a PCB’s thermal properties for providing effective heat dissipation and shows how a simple alteration to the design can help to improve the thermal performance of electronic device. Kalenik et al. present the thermal properties of modified carbon films, and the results show the strong temperature dependence of modified carbon film resistance.

In the final paper, Barbucha and Mizeraczyk review and describe the methods used for the patterning of electric circuitry on PCBs and propose a new technology for direct exposure of interconnects on PCBs, using a digital micromirror device.

I would like to thank all the authors for their scientific work and contributions that have led to the development and publication of this special issue of Circuit World. I hope that it will be of interest to readers of the journal and that it will help them to find novel solutions, contribute to the creation of new ideas and initiate many varied discussions about PCBs and related interconnect technologies. I believe that this branch of science will continue to be effectively developed in the future.

Agata Skwarek - Guest Editor