Smallest MIL-STD-1553 multi-chip hybrid interface terminals in a BGA package

Citation

(2003), "Smallest MIL-STD-1553 multi-chip hybrid interface terminals in a BGA package", Aircraft Engineering and Aerospace Technology, Vol. 75 No. 1. https://doi.org/10.1108/aeat.2003.12775aad.006

Smallest MIL-STD-1553 multi-chip hybrid interface terminals in a BGA package

Smallest MIL-STD-1553 multi-chip hybrid interface terminals in a BGA package

Keywords: Aerospace industry, Equipment

Data Device Corporation (DDC) has expanded its Enhanced Mini-ACE MIL-STD-1553 component offering with the introduction of a ball grid array (BGA) package referred to as the Micro-ACE (μ-ACE). This new package claims to have the smallest footprint of any 1553 integrated terminal in the industry and is thought to be the first of its kind offered in a BGA package. MIL-STD-1553 is the standard two-wire database system used by the majority of the Western world’s military aircraft as well as defence and space equipment (Plate 6).

“When you are designing components for military and avionics systems, keeping it small has many advantages,” noted Todd Decker, Data Bus marketing manager at DDC. “Designers have only so many square inches to work with and going from a 1 in. square gull lead package to a 0.8 in. square BGA requires 35 per cent less real estate on the card, opening up possibilities for multiple 1553 channels and other high density applications. As you would expect, this small component is also lighter weight.”

Plate 6 DDC has expanded its enhaced Mini-ACE MIL-STD-1553 component offering with the Micro-ACE, the industry’s first and smallest multi-chip hybrid interface terminals in a BGA package

The new BGA product is a plastic moulded device built on FR4 material that matches the temperature coefficient of all PC boards. “This means our product will expand and contract at the same rate as the PC board to which it is attached, resulting in a mechanically reliable assembly,” said Len Marro, vice president of Engineering at DDC. “These Micro-ACE models are the industry’s smallest MIL-STD-1553 terminals; rated to operate over industrial temperatures (−40°C to +85°C) and are impervious to moisture,” he added.

The BGA packaging is available in three μ-ACE configurations, including remote terminal-only (RT) with 4K × 16 RAM (BU-61740B3-202), and two bus controller/remote terminal/monitor (BC/RT/MT) versions with 4K × 16 RAM (BU-61840B3-202) and with 64K × 17 RAM (BU-61860B3-202). All three devices claim the full range of architectural advancements found in Enhanced Mini-ACE products, including a highly autonomous BC; a choice of RT buffering modes; a selective message monitor; a highly autonomous built-in 9 protocol and RAM self-test; and a choice of 10, 12, 16 or 20 MHz clock frequencies. Furthermore, Micro-ACE products are compliant with MIL-STD-1553A/B; STANAG 3838 and MIL-STD-1760.

Amir Massumi, director of marketing at DDC stated, “DDC has designed the Micro-ACE product line to be competitively priced for all applications, and is especially economical when purchased in large quantities.”

Details available from: Data Device Corporation. Tel: +1 631 567 5600; Fax: +1 631 567 7358.