Nelco introduces two advanced materials providing faster processing speeds

Citation

(1999), "Nelco introduces two advanced materials providing faster processing speeds", Circuit World, Vol. 25 No. 4. https://doi.org/10.1108/cw.1999.21725dad.013

Nelco introduces two advanced materials providing faster processing speeds

Nelco introduces two advanced materials providing faster processing speeds

Keywords: Nelco, Multilayers

Nelco International has introduced a series of advanced materials for multilayer interconnects that provide higher yields and faster processing speeds for printed circuit board fabrication. The materials are designed for use in a variety of applications including network computers, internet servers, telecommunication interconnects, underhood automotive and work stations.

These applications-specific materials include:

1. 1.

   N4000-6 FC, a high Tg faster curing multifunctional epoxy; and

2. 2.

   N4000-7, a low CTE epoxy with faster drilling and fast curing properties.

Nelco's fast processing advanced materials reduce the processing time at the lamination stage by up to 33 percent while providing high yields in the manufacture of fine line, high density printed circuits.

Details from 2401 E. Katella #370, Anaheim, CA 92806, USA. Tel: +1 714 634 3665; Fax: +1 714 704 4471.