Rogers improves its R/flex® 1000 circuit materials

Citation

(2000), "Rogers improves its R/flex® 1000 circuit materials", Circuit World, Vol. 26 No. 2. https://doi.org/10.1108/cw.2000.21726bad.008

Rogers improves its R/flex® 1000 circuit materials

Keywords Rogers, Flexible circuits

Rogers Corporation announces that it has made significant improvements to its R/flex® 1000 line. Historically this adhesive system, has benchmarked the high performance characteristics for flexible circuit materials used in disk drive applications. Circuits made of these materials are wire bondable and can handle tens to hundreds of millions of cycles without failure. R/flex 1000 materials can now be used to manufacture even more rigorous and reliable flexible circuits that are also lower outgassing, with improved dimensional stability for higher processing yields. The improvements were made in response to input by fabricators and hard disk drive manufacturers, and involved a series of improvements by the company to its manufacturing process.

The improved product line now meets the most demanding requirements of the hard disk drive industry for outgassing, to prevent contamination of disk drive surfaces and any other sensitive components. In addition, the materials last longer - through millions of test cycles - and carry higher circuit densities. Greater reliability results from an intensive effort to detect and eliminate any embedded defects during materials manufacturing, creating a product that is more than 50 percent cleaner. Finally, Rogers has improved the dimensional stability of its R/flex 1000 products, to significantly improve the processing yields achieved by fabricators. Together with its R/flex Crystal™ materials, which are flame retardant and transparent, and with R/flex 8080 LP liquid photoimageable covercoats, the company is working to support fabricators who are addressing the most demanding applications in the industry. The need for rugged flexible circuits with finer lines and higher densities is growing, particularly for hard disk drive, automotive underhood, and chip packaging applications.