Keywords
Citation
(2001), "Advanced tools for high density interconnection for Genesis 2000", Circuit World, Vol. 27 No. 1. https://doi.org/10.1108/cw.2001.21727aad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Advanced tools for high density interconnection for Genesis 2000
Advanced tools for high density interconnection for Genesis 2000
Keyword Frontline
Frontline PCB Solutions launches a new set of HDI tools, a High-Density Interconnection enhancement package for its Genesis 2000 CAM system. The four powerful automatic DFM tools contained in this set drastically slash editing and production time and maximise product precision in high-density boards.
The package comprises the following tools:
Dynamic Etch Compensation
Simulates a realistic, non-ideal model of etchant (etching material) behaviour patterns during chemical etching of ultra-fine line boards, and then automatically compensates for pattern data by unevenly enlarging lines based on local spacing.
Parallel Spacing Optimizer
Reduces opportunities for shorts between ultra-fine lines within a running bus across inner/outer layers. Minimises the run length of a multi-line channel by automatically enlarging its footprint width, using available space on the layer surface.
BGA Line Generation
Connects all inner networks of the circuit and extends lines to gold plating tie bars.
Hammer Head Etch Compensation
Allows copper to be added in pad corners, compensating for production-related etching deficiencies. Automatically performs etch compensation for BGA-boards and SMD pads. Maintains the design integrity of highly complex, extremely dense boards.
For further information, contact: Efrat Bar-Sella. Tel: +972 8 9322 183; Fax: +972 8 9322 186; E-mail: efrat@frontline-pcb.com; http://www.frontline-pcb.com