Citation
(2002), "IPC. Microvias and laser technology focus of IPC printed circuits expo 2002", Circuit World, Vol. 28 No. 2. https://doi.org/10.1108/cw.2002.21728bab.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
IPC. Microvias and laser technology focus of IPC printed circuits expo 2002
IPC
Microvias and laser technology focus of IPC printed circuits expo 2002 Workshops
IPC has announced its tutorial and workshop schedule for IPC Printed Circuits Expo 2002, taking place March 24–28 at the Long Beach Convention Center in Long Beach, Calif.
A total of 34 courses are scheduled, including 15 full-day tutorials on March 24–25, and 19 half- day workshops, which will take place on March 25 and 28.
Among the workshops being offered are:
- •
Value Selling in the Printed Circuit Board Industry—This course will train the manufacturer and marketer of printed circuit boards tried and proven value selling techniques.
- •
Direct Metalization Technology—Provides a thorough understanding of the reliability issues associated with the metalization of plated-through holes. Overviews of the various direct plate technologies and major direct metalization technologies will also be presented.
- •
Next Generation Interconnections: Photonics and Beyond—This course will look at the next generation of signal interconnections for ASIC packaging, portable products, high performance computing and telecom.
- •
Laser, Laser, Laser! Embedded Passives and Microvia Formation—Participants will receive a basic overview of UV:YAG, YLF, RF-CO2, TEA CO2, Excimer and other laser technologies. The latest market data on the growth of microvias in the HDI and packaging segments of the market will also be presented.
Other workshops being offered at IPC Printed Circuits Expo include Advanced Printed Circuit Board Troubleshooting: The Big, the Bad and the Ugly; Pitfalls and Roadblocks to Microvia Implementation; and Optical-Microelectronics: A Primer to Materials, Fabrication and Assembly.
Several tutorials are being offered along with the workshops including:
- •
Process Control in Printed Circuit Fabrication—This course will explain how to implement process control in the printed board manufacturing industry. Participants will learn about process control planning, analysis, control and improvement tools, identification of process control parameters and implementation of proper methods.
- •
Imaging Technologies for Advanced PWBs— Reviews new equipment, including laser direct imaging, direct structuring, projection lithography, and step and repeat systems, and evaluates which processes are best suited to certain production profiles.
- •
Flexible Circuitry Advances: Materials, Processes and Applications—This course will cover the special properties of flex and highlight the valuable differences compared to rigid PCBs. Topics will include all materials, designing, semi- additive and multi-layer processing, handling and SMT, TAB and FC assembly.
- •
High Speed Design and Impedance Control— This is an in-depth study of the concepts and practices needed to successfully design and fabricate PCBs using today's higher speed ICs and high speed devices of the future.
Other tutorials include Electrical Engineering for the Non-Degreed Engineer; Selecting, Qualifying and Managing a Printed Circuit Board Manufacturer; and High Density Base Material Alternatives to FR-4.
For a complete schedule of workshops and tutorials, visit the IPC Printed Circuits Expow 2002 Web site at www.ipcprintedcircuitexpo.org, or contact Vitas at VITARO@ipc.org or 847-790- 5308.