Keywords
Citation
(2003), "IPC Printed Circuits Expo®", Circuit World, Vol. 29 No. 3. https://doi.org/10.1108/cw.2003.21729cab.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
IPC Printed Circuits Expo®
IPC Printed Circuits Expo® 2003 technical conference and edicationsl courses to incorporate design issues
Keywords: IPC, Conference
IPC has announced the technical conference sessions and tutorial and workshop schedule for IPC Printed Circuits Expo® 2003, which takes place on 22-27 March at the Long Beach Convention Center in Long Beach, Calif. With the inclusion of the IPC Designers Council Summit, the event has a new emphasis on printed circuit board (PCB) design.
The IPC Printed Circuits Expo 2003 technical conference program, held on 25-27 March, focuses on the latest technological advances in the PCB industry and provides the most comprehensive information about new materials, techniques and processes. Two sessions, PCB Design Operations I and PCB Design Operations II, offer designers essential techniques for improving the performance of final assembled circuit boards, including topics on differential TDR, reliability, metric grid incorporation and organic light- emitting devices.
Other technical conference sessions will focus on PCB properties, technologies and materials; advanced packaging using HDI and flexible circuitry; PCB testing for troubleshooting, reliability and UL approval; PCB fabrication; designing for HDI, high speed and high frequency; embedded passive devices.
The IPC Printed Circuits Expo 2003 tutorial and workshop schedule consists of more than 40 full- and half-day programs, taking place Sunday-Monday, March 23-24 and Thursday, March 27. Seventeen design-focused tutorials and workshops have been integrated into this year's program, including the following:
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Flexible Circuitry for Engineers.
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Laminates and Multilayer Stack-Ups:The Golden Keys to Optimum Performance.
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PCB Design for RF Applications.
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Flexible Circuitry Advances:Materials, Processes and Applications.
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High Speed Design and Impedance Control.
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Electrical Engineering for the Non-Degreed Engineer.
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Micro-Via and High Density Sequential Build Up PCB Design.
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Effective Design for Manufacture.
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Ground Bounce, Bypass CAPS and ESR.
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Demystifying Controlled Impedance Boards for Non-Engineering PCB Professionals.
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Purchasing PCBs.
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The PCB Manufacturing Process:A Brief Tour.
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Next Generation Interconnections: Photonics and Beyond.
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EMI Control at the PCB Board Level.
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The How and Why of Obtaining Accurate Impedance Calculations.
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Pad Stack Design and PCB Stack-Up Generation for High Yields.
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Embedded Resistors and Capacitors:Materials, Processes and Applications.
Industry experts will also train attendees on additional PCB issues that focus on selecting, qualifying, and managing a PCB manufacturer, the fundamentals of PCBs, embedded passives and microvia formation, advanced PCB troubleshooting and understanding National Technology Roadmaps, just to name a few.
For detailed information about the IPC Printed Circuits Expo 2003 technical conference, including the workshops and tutorials, or the 2003 IPC Designers Council Summit, visit www.ipcprintedcircuitexpo.org or contact: Joe Dudeck, IPC's communications manager, at JoeDudeck@ ipc.org or 847-790-5371.