Keywords
Citation
(2003), "DDi Europe introduces Flat-Pad technology", Circuit World, Vol. 29 No. 3. https://doi.org/10.1108/cw.2003.21729cad.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
DDi Europe introduces Flat-Pad technology
DDi Europe introduces Flat-Pad technology
Keyword: DDi Europe
DDi Europe has announced its new proprietary technology that will revolutionise high density interconnect (HDI) PCB manufacturing and assembly operations. In conventional microvia construction, the placement of microvias in the middle of a ball-grid array (BGA) pad can create solder voids during the assembly process. DDI's Flat-Pad technology provides a unique solution to eliminate this downstream reliability problem in manufacturing and removes the need for costly and complex workarounds. Parent company, DDI Corp. recently filed with the US Patent and Trademark Office for the company's newly developed "Flat-Pad" technology for HDI PCB applications.
For several years, ongoing industry trends toward finer pitch and higher pin-count BGA devices have stretched the limits of current PCB assembly technology, raising concerns about long-term PCBA reliability. The development of DDi's new and innovative Flat-Pad solution is a major step toward reducing or eliminating these assembly and reliability concerns. Unlike traditional laser-formed microvia approaches, DDi's proprietary Flat-Pad technology results in a completely flat BGA component pad surface. This not only supports the current industry thrust toward Via-in-Pad (VIP) design, but also widens the process window for PCB assembly and improves final yield, which is a condition eagerly sought by high-tech customers.