Citation
(2005), "6th International Conference on Electronics Materials and Packaging (EMAP 2004)", Circuit World, Vol. 31 No. 1. https://doi.org/10.1108/cw.2005.21731aaa.002
Publisher
:Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited
6th International Conference on Electronics Materials and Packaging (EMAP 2004)
6th International Conference on Electronics Materials and Packaging (EMAP 2004) 5-7 December 2004
Bayview Beach Resort, Batu Ferringhi, Penang, Malaysia
About EMAP
The 6th Electronics Material and Packaging Conference (EMAP 2004) is an international event organized by the School of Mechanical Engineering, Universiti Sains Malaysia, and IEEE CPMT Chapter with joint technical co-sponsorship from CPMT society of IEEE.
EMAP 2004 will feature short courses, technical sessions, and exhibition. It aims to provide good coverage of developments in all areas of electronics materials and packaging, from design to manufacturing and operation. EMAP 2004 is a major forum, providing opportunities to network and meet leading experts in addition to exchange of up to date knowledge in the field. Since 1999, EMAP has gained a reputation as a premier electronics materials and packaging conference in Asia Pacific where the bulk of the packaging activities are taking place.
Conference topics
The topics of interests are specific to microsystems/ MEMS, their packaging, electronics materials and reliability issues. Extended abstracts are being sought from, but not limited to, the following areas:
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Automotive electronics;
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Chip-scale packaging/Flip chip;
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Electrical modeling and signal integrity;
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Green materials;
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High density displays;
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High density packaging;
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Interconnection technologies;
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Low cost packaging methods;
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Manufacturing technologies;
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Mechanical modeling and structural integrity;
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MEMS packaging and applications;
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Microelectronic materials and processes;
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No flow underfilling process;
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Optoelectronics/Photonics;
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Polymer materials and Microelectronic applications;
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Printed wiring and flex boards;
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Quality and reliability;
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Thermal design, analysis, and characterization;
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Thick and thin film materials;
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Wafer scale packaging;
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Wireless sensor packaging and applications; and
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Vibration on electronic devices.
Important dates
Submission of abstract: 7 July 2004Notification of acceptance: 15 July 2004Submission of manuscript: 31 August 2004
Short courses
The conference program includes short courses, which will be conducted by leading experts in the field. Details will be provided in the conference Web site and available in subsequent mailings.
Exhibition
A tabletop exhibition from suppliers of materials, equipment, components, software, and service providers of electronics industries will be held at the venue of the conference. Please contact: E-mail: jaa@eng.usm.my for details.
Conference information and contacts
Web site: wwwl.eng.usm.my/mekanik/emap2004.html
General Chair
Dr Zaidi Mohd RipinTel: 60-4-593-7788 (ext: 6300); Fax: 60-4-594-1025; E-mail: mezaidi@eng.usm.my
Technical Program Chairs
Prof. K.N. SeetharamuTel: 60-4-593-7788 (ext: 6309); Fax: 60-4-594-1025; E-mail: knramu@eng.usm.my
Teck Joo GohTel: 86-21-50481818 (ext: 34464); Fax: 86-21-50481212;E-mail: teck.joo.goh@intel.com
Secretariat
School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Perai Selatan, Pulau Pinang.Tel: 60-4-593 7788 (ext. 6301); Fax: 60-4-594-1025; E-mail: jaa@eng.usm.my