Editorial

Circuit World

ISSN: 0305-6120

Article publication date: 1 September 2005

171

Citation

Goosey, M. (2005), "Editorial", Circuit World, Vol. 31 No. 3. https://doi.org/10.1108/cw.2005.21731caa.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited


Editorial

In this issue of Circuit World, there is an interesting selection of papers covering a broad range of topics which have simply been determined by the subject matter of the papers that were submitted for this issue. Although there have been recent issues with a particular thematic content, this issue is intentionally broader in content and yet relationships between the subjects that are covered have become apparent. Tom Sutter of Rohm and Haas Electronic Materials in the USA has produced a paper on digital printing, a topic that is of increasing interest as an innovative way of rapidly and directly producing not only interconnections but also components and displays. Digital printing was the theme of a recent, very well attended Institute of Circuit Technology Seminar in South Shields, a summary of which is also included in this issue. Circuit World has a long association with the Institute of Circuit Technology and it is interesting to note that the Institute is now developing a training programme on Circuit Manufacturing. This is being done in collaboration with the newly formed Innovative Electronics Manufacturing Research Centre which has its centre at Loughborough University. Quite by co- incidence there are two papers in this issue from Loughborough University and these cover PCB substrate utilisation efficiency and the solderability of nickel phosphorus films with lead-free alloys. Lead-free assembly is also an interest of mine and so I am pleased to have had the opportunity to write a paper on the practical issues of converting to lead-free soldering on behalf of Envirowise, the UK organisation that has done so much to help the UK electronics industry to achieve cost savings through environmental best practice. The theme of environmental best practice links nicely with two more of the papers published in this issue. The paper by Narinder Bains et al. describes progress to date on a UK DTI funded programme to develop more sustainable PCB manufacturing processes that can reduce waste and which enable the reuse and recycling of materials that would otherwise be wasted. The second paper on this subject is on the environmental and economic implications of a shift to halogen-free printed wiring boards. Finally, we have a paper from Samsung in Korea detailing a multi-layer parallel lamination technique for high density, high performance printed circuit boards, which takes us full circle back to the subject of new circuit manufacturing technologies.

Regular readers will also have noticed that this issue, and the previous one, not only have a new cover design but also a new shape and size. The new design has been chosen to include what might typically be regarded as good examples of a state-of-the-art circuit boards and it is good to know that these examples were actually produced in the UK by Graphic, one of the country's leading suppliers of high technology, specialist boards. The change in page size represents an attempt to conform more closely, at a global level, with widely adopted standard journal sizes. Whilst some may miss the traditional Circuit World format, the new dimensions do enable the journal to be filed on library shelves more easily and this in turn helps to give improved accessibility, and thus an enhanced likelihood that the journal will be seen, used and read. Finally, those readers of Circuit World that have been familiar with Circuit World for a number of years will have noticed that there has also been an increase in the number of papers published in each issue and per volume. This again has been deliberate and part of a strategy to increase the coverage of the journal and to include a broader selection of papers that will appeal to a wider audience. Circuit World has always been the premier technical journal for those with an interest in circuit and interconnection related science and technology. In recent issues John Ling and I have sought to enhance further these important aspects of the journal, while also broadening the general appeal through a much more substantial rear section. I hope that you endorse the path we have taken with Circuit World and, as always, I welcome your feedback and comments. I can be contacted at mgoosey@rohmhaas.com

Martin Goosey

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