Boundary-scan market-leader JTAG Technologies launches the JT 2127 series of DIOS DIMM modules

Citation

(2006), "Boundary-scan market-leader JTAG Technologies launches the JT 2127 series of DIOS DIMM modules", Circuit World, Vol. 32 No. 4. https://doi.org/10.1108/cw.2006.21732dad.003

Boundary-scan market-leader JTAG Technologies launches the JT 2127 series of DIOS DIMM modules

Boundary-scan market-leader JTAG Technologies launches the JT 2127 series of DIOS DIMM modules

Keywords: Electrical components, Printed-circuit boards

JTAG Technologies, a provider of IEEE std 1149 compliant boundary-scan products, has introduced the JT 2127 series of digital I/O scan (DIOS) modules. The modules are available in standard dual inline memory module (DIMM) and small outline DIMM form factors and facilitate the enhanced testing of complex printed circuit boards (Plate 1).

Plate 1 Boundary-scan market-leader JTAG Technologies launches the JT 2127 series of DIOS DIMM modules

When connected to a circuit board, a JT 2127 DIOS test module enhances regular device interconnect tests by exercising the board's connections and/ or test-points in sync with native boundary-scan components. Moreover, the modules feature carefully selected complex programmable logic devices and an oscillator that can be programmed to perform more custom functional and pattern tests.

To facilitate the testing of boards not fitted with DIMM sockets, a DIOS module carrier (available separately) can be used to break-out the module's I/O into blocks of 32 channels. These I/O channels can be further sub-grouped into blocks of 16 channels. To reduce scan chain length and improve test efficiency any number of 16-channel groups can be bypassed.

Selected channels can be interfaced with custom cabling to the board under test for low volume applications or interfaced with bed-of-nails fixtures for higher volume production. The I/O channels are individually programmable as input, output, bi- directional or tri-state signals.

The DIMM DIOS modules feature intelligent sensing of voltage rails for power supply checking.

The mechanical form and pin arrangement of the DIMM DIOS modules follow the JEDEC Standard 21C allowing easy integration within a production test fixture using standard connectors or directly on a target PCB and providing access in close proximity to the test points. Standard DIMM sockets pin-outs include 100, 168, 184, 200, 240, 278 and 300 and small outline DIMM socket pin-outs include 144, 200 and 214.

For further information, visit web site: www.jtag.com