Capacity for preparation of advanced electronic devices

Circuit World

ISSN: 0305-6120

Article publication date: 18 May 2010

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Citation

(2010), "Capacity for preparation of advanced electronic devices", Circuit World, Vol. 36 No. 2. https://doi.org/10.1108/cw.2010.21736bab.007

Publisher

:

Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited


Capacity for preparation of advanced electronic devices

Article Type: Industry news From: Circuit World, Volume 36, Issue 2

There is currently spare capacity for the preparation of advanced electronic devices at the Particle Physics Silicon Laboratory at Birmingham University. The facility was created to build hybrid silicon pixel detectors for the Large Hadron Collider (LHC) at CERN. A summary of the facilities and what they are capable of is given in the following link: www.ep.ph.bham.ac.uk/general/SiliconLab/index.html

Equipment they have includes:

  • Delvotec automatic ultrasonic wire bonding machine;

  • bond pull tester;

  • design environmental test chamber, with N2 supply;

  • manual probe station;

  • Dotmaster automated dispensing machine;

  • manual die bonder;

  • hybrid/PCB cleaning system;

  • oven; and

  • stereo microscopes.

The laboratory at Birmingham has been dedicated to the LHC task and has two very experienced technicians but is now under-utilised and Birmingham are wondering if there are any other institutes or industrial concerns that could make use of the facility. There are several schemes run by their research council which give incentives for this sort of knowledge exchange, both to the university and an industrial partner.

If there is anyone who would be interested in taking advantage of the spare capacity then the person to contact at Birmingham for more details is: Simon Pyatt, Tel.: 0121 414 4615/4616; E-mail: S.PYATT@bham.ac.uk

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