iNEMI organises four new packaging initiatives

Citation

(2010), "iNEMI organises four new packaging initiatives", Circuit World, Vol. 36 No. 3. https://doi.org/10.1108/cw.2010.21736cab.005

iNEMI organises four new packaging initiatives

Article Type: Industry news From: Circuit World, Volume 36, Issue 3

Projects will look at warpage, wiring density and holistic modelling.

The International Electronics Manufacturing Initiative (iNEMI) is organising four new initiatives to address gaps in organic substrate technologies. These initiatives will focus on warpage (understanding the causes of, and establishing methods for measuring), wiring density and holistic modelling. Industry discussions at iNEMI’s Packaging Substrates Workshop (Nagoya, Japan, November 2009) identified and prioritized technology requirements for next-generation organic substrates and packages.

Subsequent discussions by iNEMI-led organizing teams identified opportunities to address industry needs and defined these new initiatives.

The four proposed initiatives are:

1. 1.

   Primary factors in warpage. This initiative will focus on gaining a greater understanding of the causes of warpage, particularly in first and second level assembly, in order to better control it. The team will identify key material properties, process parameters, reflow profiles, package pitches, environmental factors and other contributors that impact warpage.

2. 2.

   Warpage qualification criteria. Current standards do not adequately predict good yield results at first and second level assembly. This initiative proposes to define a qualification method and criteria that will more accurately predict results (e.g. sample size, precondition, variations of material and processes) and establish measurement methods (dimensional and test).

3. 3.

   Wiring density program. This program plans to develop a system-optimized, next generation plus one technology that focuses on prioritized areas to achieve maximum wiring density at minimal cost (e.g. material set, low-cost lithography/laser, plating, inspection, and test).

4. 4.

   Holistic modelling process. The goal is to develop a multilevel design tool to optimize package designs for electrical, mechanical and thermal performance. The team proposes to identify critical materials properties and proposed specifications for a specific package type; determine data depth/accuracy in critical materials properties required for model effectiveness; and develop a holistic approach by involving data experts from materials, packaging and substrate suppliers.

These initiatives are still in the organizational stage and anyone who is interested can participate in the regular teleconferences. Details about dates, times and call-in information can be obtained by contacting Jim Arnold (North America) at: jim.arnold@inemi.org; or Haley Fu (Asia) at: haley.fu@inemi.org

For further information, please visit: www.inemi.org