Electroless Copper Plating Troubleshooting

Abstract

The high cost of copper combined with a world shortage has emphasised the need for economy in its many applications. The manufacture of printed circuits by the etched foil technique produces a wastage of 60–80% of the copper cladding of the boards and although recovery of the copper can be effected, the process is costly and time consuming to an extent that makes it impracticable for the printed circuit manufacturer. With the increasing use of additive processes for printed circuit manufacture and the consequent saving in copper wastage, the use of electroless copper plating has assumed even greater significance than for its application to through hole plating and the advantages gained by freedom from the current density problems associated with electroplating need no stressing.

Citation

Shemilt, H.R. (1974), "Electroless Copper Plating Troubleshooting", Circuit World, Vol. 1 No. 1, pp. 7-10. https://doi.org/10.1108/eb043504