Quality Assessment: 8—Degassing

Abstract

Degassing is a problem generally associated with PWB's having plated through holes. This problem is generally realised when blowholes and/or voids are observed in the solder fillets affected by the soldering operation. These undesirable, incomplete solder joints are the result of the escape of volatilised substances from the laminate or entrapped beneath the PTH metallisation. Absorbed moisture in the laminate, entrapped processing chemicals or insufficiently cured laminate materials are commonly the source of the resulting problem.

Citation

(1977), "Quality Assessment: 8—Degassing", Circuit World, Vol. 3 No. 4, pp. 16-17. https://doi.org/10.1108/eb043563