Epoxies in Thick Film Hybrid Circuits

Abstract

Conductive and non‐conductive epoxies suitable for thick film circuits have been available since about 1970. They were originally intended for mounting semiconductor chips as an alternative to eutectic bonding, but they are now used for a much wider range of applications. This paper discusses the practical problems and results of epoxy mounted semiconductors in the light of five years manufacturing experience, and goes on to look at some of the latest applications for epoxies in thick film hybrids.

Citation

Marshall, C. (1977), "Epoxies in Thick Film Hybrid Circuits", Circuit World, Vol. 3 No. 4, pp. 25-28. https://doi.org/10.1108/eb043567