Photographic Imaging of UV Liquid Photoresists—A New, Fully Automated Process

Abstract

The new process was developed to offer a superior method of forming a resist pattern on a copper‐clad laminate acting as plating and etch resist. The advantages over existing methods include superior resolution, increased automation, improved reliability, and lower applied cost. The process is unique, combining the precise coating of the blank board with UV coating resist, exposing the resist through a phototool held precisely off‐contact and the development of the formed latent image with an aqueous solution. The processing is carried out using fully automated equipment without any manual handling of either laminates or phototool.

Citation

Elsberg, E. (1984), "Photographic Imaging of UV Liquid Photoresists—A New, Fully Automated Process", Circuit World, Vol. 10 No. 4, pp. 52-53. https://doi.org/10.1108/eb043738