A New, One‐component Dicy‐free Epoxy Resin System Developed for FR‐4 Glass/Epoxy Laminates

Abstract

This new system does not use dicyandiamide or any other amine as the curing agent and has no problems with crystallisation either of the varnish or on the prepreg. The system can be used at a relatively low solvent content and the solvents used have favourable toxicity. Since it is a one‐component system it reduces the number of products stored by the laminator and eliminates some blending steps in his manufacturing process. The system produces laminates with an excellent all‐round performance in Tg, moisture resistance, etc. Laminates also exhibit significantly increased resistance to CAF growth, a cause of long‐term failure in PCBs.

Citation

Sexton, D. (1987), "A New, One‐component Dicy‐free Epoxy Resin System Developed for FR‐4 Glass/Epoxy Laminates", Circuit World, Vol. 14 No. 1, pp. 44-46. https://doi.org/10.1108/eb043939