Development of Copper‐clad Polyimide Glass Laminates

Abstract

Copper‐clad polyimide glass laminates that pass the GPY/Polyimide Specifications of IPC‐L‐108A have been developed using the Michael reaction of bismaleimide and m‐aminophenol. The addition reaction of m‐aminophenol to N‐phenylmaleimide has been confirmed from NMR, IR, and ultimate analysis. The peel strength of copper‐clad laminates is 1·8–2·0 kg/cm. The coefficient of expansion in the Z direction (25°C–246°C) is 0·96%. The glass transition temperature with post‐curing for an hour at 250°C is about 295°C. Water absorption by IPC‐L‐108A is 0·25%.

Citation

Matsuda, I. (1988), "Development of Copper‐clad Polyimide Glass Laminates", Circuit World, Vol. 14 No. 2, pp. 63-67. https://doi.org/10.1108/eb043955