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The Use of Polymer Thick Film for Making Printed Circuit Boards

F.W. Martin (Electro Materials Corporation of America, Mamaroneck, NY, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 January 1982

67

Abstract

The electronics industry is facing a situation in which the cost of electronic functions is dropping continuously while the cost of interconnecting the functions by traditional means, especially through the use of printed circuit boards, continues to rise. Polymer thick film is one proven approach to reversing the trend of rising interconnection costs. It is relatively easy for the typical printed circuit board manufacturer to convert to or adapt polymer thick film because he has most of the necessary equipment, technical knowledge and personnel.

Citation

Martin, F.W. (1982), "The Use of Polymer Thick Film for Making Printed Circuit Boards", Microelectronics International, Vol. 1 No. 1, pp. 22-23. https://doi.org/10.1108/eb044111

Publisher

:

MCB UP Ltd

Copyright © 1982, MCB UP Limited

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