Complementary Technologies—A Comparison of Electronic Packaging Technologies for Circuit Realisation
Abstract
This paper outlines the results of a study (initiated in June 1981) of the optimum packaging and interconnection techniques for a specific electronic sub‐system which was to go into production by the end of the first quarter of 1982. The risks and advantages of using various technologies were investigated and the technology chosen was a compromise between manufacturing cost, risk and time scale.
Citation
Spiller, D.O. (1982), "Complementary Technologies—A Comparison of Electronic Packaging Technologies for Circuit Realisation", Microelectronics International, Vol. 1 No. 1, pp. 47-48. https://doi.org/10.1108/eb044116
Publisher
:MCB UP Ltd
Copyright © 1982, MCB UP Limited