Solderable Polymer Thick Film Conductors for Surface Mount Technology

Abstract

A new class of solderable PTF materials has been evaluated for SMDs on FR‐4 substrates. No etching or plating baths are required in this totally additive process. The materials are printed in the desired geometry, cured by heat or infra‐red followed by soldering and device mounting. The study examines processing variables and resultant cured film properties including solderability, conductivity and adhesion.

Citation

St. John, F. (1985), "Solderable Polymer Thick Film Conductors for Surface Mount Technology", Microelectronics International, Vol. 2 No. 2, pp. 20-23. https://doi.org/10.1108/eb044172