The Future of Electronics in Europe
T. Donnelly
(BPA (Technology & Management) Ltd, London, England)
34
Abstract
The paper reviews major changes in technology, integrated circuit packaging, materials and surface mounting techniques, and assesses their impact on the printed circuit board industry. It identifies major forces and examines interconnection technologies such as thick film and new techniques for providing interconnections of ICs as related to the technology in Europe.
Citation
Donnelly, T. (1985), "The Future of Electronics in Europe", Circuit World, Vol. 11 No. 2, pp. 28-30. https://doi.org/10.1108/eb045989
Publisher
:MCB UP Ltd
Copyright © 1985, MCB UP Limited