Metallographic Examination of Soldered Joints

Abstract

Metallographic sections are an indispensable tool in the assessment and failure analysis of solder joints, as surface appearance is an unreliable guide to their internal state. This paper outlines methods for the preparation of sections through solder joints, and gives some guidelines for their interpretation. Finally, some typical features and defects are discussed.

Citation

Steen, H.A.H. (1988), "Metallographic Examination of Soldered Joints", Circuit World, Vol. 14 No. 3, pp. 37-40. https://doi.org/10.1108/eb046017