A New Adhesive System for Heat Sink Bonding
S. Hamilton
(Clyde Product Technology Ltd, Bridge of Weir, Scotland)
24
Abstract
Current techniques for bonding thermal planes or heat sinks utilise materials and methods initially designed for other applications and so have several disadvantages. The new system described in this paper has been developed to give the optimum combination of bonding properties for this specific application.
Citation
Hamilton, S. (1991), "A New Adhesive System for Heat Sink Bonding", Circuit World, Vol. 17 No. 2, pp. 16-17. https://doi.org/10.1108/eb046122
Publisher
:MCB UP Ltd
Copyright © 1991, MCB UP Limited