Equipment Selection for Tape Automated Bonding (TAB)
M.C. Miller
(Electronic Assembly Development Center, Hewlett Packard, Palo Alto, California, USA)
25
Abstract
The manufacturing process involving the bonding of ultra‐fine pitch TAB solder joints into printed circuit substrates requires precision equipment. This paper describes the basic components of any type of outer lead bonding (OLB) TAB equipment. It goes on to explain a selection methodology to be used when selecting equipment for customer applications. Specific examples are used to aid the equipment consumer in selecting the optimum equipment set and verifying the machine's accuracy and reliability.
Citation
Miller, M.C. (1993), "Equipment Selection for Tape Automated Bonding (TAB)", Circuit World, Vol. 19 No. 3, pp. 49-52. https://doi.org/10.1108/eb046213
Publisher
:MCB UP Ltd
Copyright © 1993, MCB UP Limited