Reducing Plated‐through Hole Copper Loss during Pin‐in‐hole Rework — Polymer Barrier Film Process

Abstract

In an electronic manufacturing environment, rework of pin‐in‐hole components on printed circuit boards is an essential process. Rework enhances product yield and through‐put efficiency by allowing device repair to occur quickly and at significantly reduced costs in comparison with complete board reconstruction. However, current rework techniques are not without their shortcomings, most notably enhanced dissolution of copper in plated‐through holes. This paper discusses a new methodology using polymer films as barrier layers, resulting in negligible plated‐through‐hole copper dissolution when conventional rework technologies are practised.

Citation

Davis, C.R. (1993), "Reducing Plated‐through Hole Copper Loss during Pin‐in‐hole Rework — Polymer Barrier Film Process", Circuit World, Vol. 20 No. 1, pp. 4-6. https://doi.org/10.1108/eb046230