Call for papers for China SMT Forum 2008 now open

Citation

(2008), "Call for papers for China SMT Forum 2008 now open", Soldering & Surface Mount Technology, Vol. 20 No. 1. https://doi.org/10.1108/ssmt.2008.21920aac.001

Call for papers for China SMT Forum 2008 now open

Call for papers for China SMT Forum 2008 now open

Stuttgart/Shanghai, January 15, 2008 – After its successful premier last year in Shanghai, the China SMT Forum has now been scheduled for November 4-6, 2008 and will take place in the Shanghai International Exhibition Center (INTEX). The organiser Business Media China AG has issued the call for papers and is again expecting 250 participants for the conference and most industry leaders to attend the newly developed exhibition, which is already half sold out.

The conference program will be planned again by a professional committee, which is directed by Professor Dr Mathias Nowottnick (University of Rostock, Germany). Further committee members are renowned persons representing the scientific as well as the application- oriented sectors of the industry: Professor Bernd Michel, Professor Thomas Gessner, and Mr Rolf Aschenbrenner from the Fraunhofer IZM, Germany, as well as representatives from leading industry players such as Heraeus, Seho, Siemens, and Flextronics.

For the conference, the committee has defined six sessions on lead-free soldering and RoHS-conform technologies, semiconductor packaging and power electronics, PCB Technologies, surface finishes and quality control, reliability and testing, assembling and soldering technologies, and a session on electronic markets and future trends. Paper abstracts should fit into these topics and should be submitted before April 15, 2008.

The first China SMT Forum was held from March 22-23, 2007, at the Shanghai International Convention Center. The conference hosted more than 200 domestic and international delegates from over 100 companies representing the SMT, semiconductor, and microelectronics manufacturing industry. Approximately, 60 percent of the attendees came from the application sector; around 30 percent represented equipment suppliers, including key players like Sharp, Intel, Panasonic, GE, Huatian, Flextronics, Vtech, Huawei, Juki, Siemens, Philips, Bosch, Guangda, and many more. The keynote speakers Professor Hans-Jürgen Albrecht (Siemens), Dongkai Shangguan (Flextronics), Dr Hannes Voraberger (AT&S), Joey Pan (Bosch Sensortec), and Professor Wolfgang Scheel (Fraunhofer IZM) presented insights into the latest developments of the industry and guaranteed the high level of the event.

The target of the China SMT Forum is to include the Chinese market into the global information exchange in the fields of SMT, electronic packaging, and assembly. In order to realise this target and to respond to the industry's strong demand, the organiser will establish a concurrent exhibition that will showcase state-of-the-art solutions and future technology trends. The China SMT Forum is supported by major industry leaders as well as the Productronic section of the German Manufacturers Association (VDMA Productronic).

China's SMT equipment market is predicted to experience continuous growth due to increasing market demand from end-user sectors. Recent data from Frost & Sullivan reveal that China's SMT equipment market earned revenues of US$1.8 billion in 2004 and is expected to reach US$3.5 billion in 2011.

Business Media China AG is an international stock exchange listed media company, which combines key competences in advertising solutions, exhibition organising, and trade publishing. Business Media China AG was founded by Mr Klaus M. Hilligardt, who also created the SMT/Hybrid/ Packaging in Nuremberg.

Further information regarding the China SMT Forum can be found online at: www.chinasmtforum.com/

Press Contact: Ms. Guli Ai, Business Media China AG, Rotebuehlstr 87 70188 Stuttgart, Tel: +49 711 490 890 0, Fax: +49 711 490 890 10, E-mail: guli.ai@businessmediachina.com