Table of contents
Potential low‐cost palladium‐alternatives for activating electroless copper deposition
Edith SteinhäuserThe purpose of this paper is the investigation of the catalytic activities of selected metals in reductant oxidation.
Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticles
A.J. Cobley, D.J. Comeskey, L. Paniwnyk, T.J. MasonThe purpose of this paper is to investigate if copper nanoparticles could be utilized for two types of through hole plating in printed circuit boards, namely: as a catalytic…
PCB process mechanization: various ways to automate
Happy HoldenThe purpose of this paper is to present an updated overview of printed circuit manufacturing equipment from the perspective of “mechanization strategies and systems” in order to…
Development of an ultra‐small micro drill bit for packaging substrates
Lianyu Fu, Qiang GuoThe paper aims to present key points regarding the development of an ultra‐small micro drill bit for packaging substrate hole processing.
FR4 loss measurement for high volume manufacture (HVM): where next?
Paul CarreThe paper aims to examine some of the requirements for an industrial strength loss measurement technique in FR4 laminate printed circuit boards and, in particular, to take a…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari